Capture Greater Efficiency With 3D Molded Interconnect Devices
Three-dimensional molded interconnect devices (3D-MID) are often used in the aerospace, military, medical device, RFID, RF antenna, security housing, and connector industThree-dimensional molded interconnect devices (3D-MID) are often used in the aerospace, military, medical device, RFID, RF antenna, security housing, and connector industry.
At Source Point Associates, we work with SelectConnect Technologies to provide you with superb 3D molded interconnect devices for all of your technology needs. 3D-MIDs have many advantages over 2D circuit boards, including the ability to create circuit paths on non-conducting materials and less complex components that lower the size, weight, and assembly time of the device.
Our 3D-MIDs are manufactured by laser direct structuring (LDS) or double-shot molding. LDS is a specialized technique that can reduce the cost of materials, eliminate wiring and interconnects, speed up assembly time, and improve the overall reliability of the device.
The applications of this technology are varied. 3D-MIDs can be used in insulin pump chassis, hearing aids, hand-held diagnostic pens, IV regulators, glucose meters, dental tools, and more. If you want to save time and money while increasing the overall quality of your device, then contact Source Point Associates to learn more about our 3D Molded Interconnect Device capabilities.
LDS grade materials available for use:
Through our vendor, SelectConnect, we can construct 3D Molded Interconnect Devices (3D-MIDs) using the following materials:
- BASF Nylon PA6/6T
- Xantar PC/ABS (Formerly DSM)
- Lanxess PET/PBT Blend
- Lanxess PBT
- Mitsubishi PC
- RTP 2599 X 113384 D PC/ABS
- RTP 2599 X 113384 C PC/ABS
- RTP 699 X 113386 B ABS
- RTP 399 X 113385 B PC
- RTP 299 X 113399 H PA Nylon 6/6
- RTP 3499-3 X 113393 A LCP
- RTP 3499-3 X 113393 C LCP
- RTP 4099 X 117359 D PPA
- Sabic PC/ABS
- Ticona LCP