SelectConnect Technologies, a Division of Arlington Plating Company, manufactures three-dimensional molded interconnect devices (3D-MID) for the military, aerospace, medical device, RF antenna, RFID, sensor, security housing and connector markets.
A 3D-MID consists of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components.
Compared to 2-dimensional printed circuit boards or a flexible circuit wrap, a 3D-MID can take the shape of a molded component allowing circuit paths to be created on non-conductors, typically used for the enclosure, chassis, and device structure. The electrical path is patterned in true 3D with x, y and z-patterns following the contour of the molded component.
Designing systems with LDS 3D-MID components allow designers to reduce the bill of material (BOM), the complexity of components, size, weight and assembly times by having fewer components, wires and interconnects.
LDS 3D-MID's are created by thermoplastic resin doped with an organometallic material. Circuit layouts are patterned on the molded component with a process called Laser Direct Structuring or LDS, using a laser beam from the LPKF Microline 3D laser system to create the desired circuit paths. The laser defined pattern is then plated with electroless copper, electroless nickel, and immersion gold to enhance the electrical and assembly characteristics of the 3D-MID.
LDS 3D-MID's are created by first molding a component from thermoplastic resin doped with an organometallic material. Circuit layouts are patterned on the molded component with a process called Laser Direct Structuring or LDS, using a laser beam from the LPKF Microline 3D laser system to create the desired circuit paths. The laser defined pattern is then plated with electroless copper, electroless nickel, and immersion gold to enhance the electrical and assembly characteristics of the 3D-MID.
LDS produced 3D-Molded Interconnect Devices (3D-MID) reduce the bill of materials, eliminate wires and interconnects and reduce assembly time delivering improved reliability.
Laser Direct Structuring (LDS) is a process to produce circuit layouts on complex three-dimensional carrier structures to effectively reduce weight and fitting-space. Designers enjoy complete 3-D capability on free-form surfaces, greater freedom for redesigns, the possibility of using surface mount technology and significant cost reductions through elimination of the number of components, reduction of wires and interconnects and the resultant decrease in assembly times. This talk describes the LDS technology, materials, design considerations, the metallization process and numerous examples of applications currently in production or development.
SelectConnect Technlogies is an ISO 9001 and ITAR registered company.
SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components and selectively plates circuits integrated into components produced by the Double-Shot molding process.
As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes scale up to high-volume production. Contact us to learn more about our processes and technologies. We are happy to help.
SelectConnect Technologies and Design Engine team up to present a technical review seminar. See the short version.
With applications as diverse as Insulin Pump Chassis, Hearing Aids, Hand-held Diagnostic Pens, IV Regulators, Glucose Meters, and Dental Tools, the SelectConnect process has been proven to meet the rigorous demands required of high performance medical devices. In addition, by reducing the number of components and system assembly time, significant overall system cost reductions can be achieved.
LDS grade materials are available from a number of suppliers, in a wide range of properties.
